It's been widely speculated by different news outlets that the Apple iPhone 7 will have a camera bump. Based on the latest reported leaks, it seems that those rumors may be warranted.

The GSM Arena published alleged leaked images of the new phone which clearly shows a bulge surrounding the main snapper. However, there's no way to gauge just how thick the protrusion is, but it's obviously much more prominent that the current models.

"It seems to line up with a protective case, so we're maybe looking at a millimeter," it said.

In other news, the Apple iPhone 7 will reportedly have no 3.5mm headphone jack, which is consistent with the earlier reports that it's going to the thinnest in the company's mobile phone line with the numbers 6mm and 6.5mm being bandied about.

"If TSMC makes the chips, as has been rumored, then some space could be saved, which might help Apple slim it down without making sacrifices in other areas," Tech Radar said.

The other design changes point to a bezel-less display screen, which could help shave off a few millimeters from the thickness. There are also reports of the Apple iPhone 7 being waterproof and dust-proof just like the Samsung Galaxy S7.

Previous news reports alleged that the Apple iPhone 7 Plus will feature a dual-camera.

"The smaller 4.7 inch iPhone 7 will also receive a camera upgrade," said 9to5 Mac. "The hole is substantially larger and the entire component has been aligned closer to the corner of the device, indicating some kind of upgrade."

Apple is set to launch two or three iPhones in September, 2016.